• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:NL1037855A
    申请号:NL1037855
    申请日:2010-04-06
    公开日:2010-11-09
    发明作者:Gerd Jaeger
    申请人:Sios Messtechnik Gmbh；
    IPC主号:
    专利说明:

    Device for the measurement of force components
    The invention relates to a device for measuring force components with a sensor element, a sensor pin and spring elements with expansion sensors.
    Various devices for measuring force components are known in the prior art.
    A micro probe for measuring forces in x, y and z directions is from the print "GN Peggs, AJ Lewis, S. Oldfield: Design for a compact high-accoracy CMM; in Annals of the CIRP, Vol. 48 / 1/1999, pages 417-420 ". With these sensors, forces are transmitted to flexible spring elements by means of a sensor element and a sensor pen. The deflections of the spring elements are measured with capacitive sensors.
    A triaxial force sensor is described in mst / news, Nr. 1/09, February 2009, pp. 16-17 "Multidimensional Force and Displacement Sensor for Micro Metrology", A. Tribrewla, A. Phataralaoha and St. Büttgenbach. Piezoresistors on bridges are connected together in a silicon membrane. The diaphragm is connected with a touch pen with a contact ball.
    In Sensor Magazin 2/2008, pages 30-32, the article with the theme "Innovativer miniaturisierter 3D Kraftsensor für Koordinatenmesssystem von Mikrokomponenten" describes a three-dimensional measuring force sensor. The sensor consists of a flexible silicon cross structure. The touch of objects takes place via a touch pen with a touch ball. The forces effect a deformation of the cross structure, which are detected via piezo-resistant expansion sensors.
    Further disclosures of modified probes with silicon membrane and integrated sensors are contained in the following references: E.J. Bos: Tactile 3D probing system for measuring MEMS with nanometer uncertainty; ISBN 978-90-386-1216-4; Thesis, Eindhoven Univ. of Technology, 2008; V. Nesterov and U. Brand: Modeling and investigation of the silicone twin design 3D micro probe; Journal of Micromechanics and Microengineering; 15 (2005), 514-520.
    Furthermore, a sensor module for a sensor head of a tactile coordinate measuring device is known from WO 2006 010 395 A2. This comprises a frame, which forms a fixed module basis and thereby defines a first measuring surface. Furthermore, a part of the coordinate measuring device relative to the frame is movable for receiving a proximal end of a touch probe, the movable part being held on the frame by at least two, preferably by four, webs separated from each other. In order to achieve increased rigidity, each of these webs has a material-strong web area in the cross-section perpendicular to a first measuring surface, which web material is designed between two material-weak web areas, wherein the material-strong web area has a material thickness greater than a corresponding material thickness of the material-weak body ranges.
    The main disadvantage of the prior art probes with silicon deformation bodies and integrated piezoresistors is that in the force measurement of the stiffnesses, ie the spring constants, in the z direction essentially the stiffnesses in x- and y- distinguished direction. This leads to considerable measurement errors due to the different flattening at the touch of measurement objects.
    It is therefore an object of the invention to provide a device for measuring force components at the touch of measuring objects, the measurement errors being largely avoided due to different flattening in different coordinates.
    The object is solved according to the invention by a device which has the features indicated in claim 1.
    Advantageous embodiments of the invention are the subject of the sub-claims.
    The device according to the invention for measuring force components at the touch of measuring objects comprises a sensor element, a sensor pin and spring elements which are connected to each other by spacers, so that parallel spring arrangements are formed. With these parallel spring arrangements there are expansion sensors on a spring element, which are connected together to form a Wheatstone bridge. The device comprises three parallel spring arrangements which are connected to each other via spacers in such a way that the stylus is movable in three coordinates and measurement by three force components is possible. Each parallel arrangement makes it possible to measure a power component. The three interconnected parallel spring arrangements are designed such that all three have the same rigidity. Equal stiffness means that the stiffnesses of the parallel spring arrangements have only deviations of at most + 5%, preferably of at most + 3%. This results in a clear reduction of the measurement uncertainty compared to the arrangements known from the prior art.
    An advantageous embodiment provides that piezo-resistive resistors are used as expansion sensors.
    The spacers for the connection of the spring elements resp. for the arrangement of the parallel spring arrangements below each other, silicon or glass can optionally be produced.
    Furthermore, it is possible that the spacers and the spring elements consist of synthetic quartz glass. In this case, the expansion sensors are mounted on it.
    For the arrangement of the four expansion sensors arranged on a spring element, it is advantageously symmetrical with respect to the zero voltage line.
    By means of established semiconductor technologies, silicon springs with integrated piezo-resistive resistors, which are connected to a Wheatstone bridge, cannot be made expensive.
    Embodiments of the invention are explained in more detail below with reference to drawings.
    Show:
    Figure 1 is a front view of the device,
    Figure 2 is a side view of the device,
    Figure 3 shows a perspective view of the device and
    Figure 4 shows a cross-section on the side view of the device
    Corresponding parts are provided with the same reference sign in all figures.
    The device 1 for measuring force components for the contact of measuring objects represented in Figure 1 comprises a sensing element 6, a sensing pin 5 and the spring elements 2.1, 2.2, 3.1, 3.2, 4.1, 4.2. In the spring elements 2.1, 3.1. and 4.1 piezoresistent expansion sensors 2.5, 3.5 and 4.5 are integrated, which are switched to a Wheatstone drug. The silicon springs 2.1. and 2.3 are connected by spacers 2.3 and 2.4. The silicon springs 3.1 and 3.2 are connected by the spacers 3.3 and 3.4. The silicon springs 4.1 and 4.2 are through the spacers 3.4 and 4.4. connected, with 3.4 being both spacer for silicon springs 3.1 and 3.2 as well as for silicon springs 4.1 and 4.2. In the spacer 4.4. the sensor pin 5 is mounted, which carries the sensor element 6. The spacer 2.3 is fixedly connected to the frame 1.
    The spacers 2.3, 2.4, 3.3, 3.4 and 4.4. can be made from both silicon and glass. Furthermore, it is possible that the spring elements 2.1, 2.2, 3.1, 3.2, 4.1, 4.2 and the spacers 2.3, 2.4, 3.3, 3.4, 4.4 consist of synthetic quartz glass.
    Figure 2 shows a side view of the device. In addition to Figure 1, the attachment of the touch probe 5 with the touch probe 6 to the connecting piece 4.4 is shown. Furthermore, the spring elements 4.1 and 4.2, which are connected by the spacers 3.4 and 4.4, are shown. The design of the spacer 3.4, which connects both the spring elements 3.1 and 3.2 as well as the spring elements 4.1 and 4.2, is also visible.
    Figure 3 shows the device in perspective. The representation shows how the parallel springs formed from silicon springs 2.1 and 2.2, 3.1 and 3.2, 4.1 and 4.2 are connected to each other, so that a device for measuring the forces Fx, Fy and Fz is created.
    Figure 4 shows the cross-sectional view of a parallel spring arrangement with four expansion sensors 3.5.1, 3.5.2., 3.5.3. and 3.5.4, which are mounted in a Wheatstone circuit bridge. The expansion sensors 3.5.1, 3.5.2, 3.5.3 and 3.5.4 are arranged symmetrically with respect to the zero voltage line. If the parallel springs 4.1 and 4.2 are deflected, the expansion sensors 3.5.1 and 3.5.4 are stretched, while the expansion sensors 3.5.2 and 3.5.3. be compressed. This results in zones with elongations and compressions, whose absolute amounts are equal. These ranges are separated by the zero voltage line. This allows the realization of complete Wheatstone bridges with the supply voltages UB and the diagonal voltages UD.
    List of reference marks 1 Frame 2.1, 2.2, 3.1, 3.2, 4.1, 4.2 Spring elements 2.5, 3.5, 4.5 Expansion sensors 2.3, 2.4, 3.3, 3.4, 4.4 Spacers 5 Touch pin 6 Touch element UB Supply voltage UD Diagonal voltage
    权利要求:
    Claims (7)
    [1]
    Device for measuring force components (Fx, Fy, Fz) with a sensor element (6), a sensor pin (5) and spring elements (2.1, 2.2, 3.1, 3.2, 4.1, 4.2) with expansion sensors (2.5, 3.5, 4.5 ), characterized in that the spring element (2.1) has expansion sensors (2.5) and is connected to the spring element (2.2) via the spacers (2.3) and (2.4), the spacer (2.3) is arranged on a frame (1) , the spacer (3.3) is attached to the spacer (2.4), the spring element (3.1) contains expansion sensors (3.5) and is connected to the spring element (3.2) via the spacers (3.3) and (3.4), that the spring element (4.1) ) has expansion sensors (4.5) and is connected to the spring element (4.2) via the spacers (3.4) and (4.4) and to the spacer (4.4) a sensor pin (5) with sensor element (6) is fitted, and all spring elements (2.1) , 2.2, 3.1, 3.2, 4.1, 4.2) have the same rigidity and the four expansion sensors (2.5, 3.5, 4.5) mounted on a spring element to form a bridge of Wheatstone are connected together.
    [2]
    Device according to claim 1, characterized in that the expansion sensors (2.5, 3.5, 4.5) are piezoresistent resistors.
    [3]
    Device according to one of the preceding claims, characterized in that the spacers (2.3, 2.4, 3.3, 3.4, 4.3, 4.4) and the spring elements (2.1, 2.2, 3.1, 3.2, 4.1, 4.2) consist of silicon.
    [4]
    Device according to one of claims 1 to 4, characterized in that the spacers (2.3, 2.4, 3.3, 3.4, 4.3, 4.4) consist of glass.
    [5]
    Device according to one of the preceding claims, characterized in that the spacers (2.3, 2.4, 3.3, 3.4, 4.3, 4.4) and the spring elements (2.1, 2.2, 3.1, 3.2, 4.1, 4.2) consist of synthetic quartz glass.
    [6]
    Device according to claim 5, characterized in that the expansion sensors (2.5, 3.5, 4.5) are arranged on the spring elements (2.1, 3.1, 4.1).
    [7]
    Device as claimed in any of the foregoing claims, characterized in that the four expansion sensors arranged on a spring element are arranged symmetrically with respect to the zero-voltage line.
    类似技术:
    公开号 | 公开日 | 专利标题
    NL1037855C2|2010-12-08|DEVICE FOR THE MEASUREMENT OF POWER COMPONENTS.
    US7441470B2|2008-10-28|Strain gauge type sensor and strain gauge type sensor unit using the same
    Amarasinghe et al.2007|Development of miniaturized 6-axis accelerometer utilizing piezoresistive sensing elements
    Wang et al.2000|A silicon-based shear force sensor: development and characterization
    TWI414478B|2013-11-11|Mems sensor capable of measuring acceleration and pressure
    NL1037143C|2010-03-09|DEVICE FOR THE TACTICAL MEASUREMENT OF THREE-DIMENSIONAL FORCES.
    Tibrewala et al.2008|Simulation, fabrication and characterization of a 3D piezoresistive force sensor
    Tang et al.2009|MEMS inclinometer based on a novel piezoresistor structure
    Tibrewala et al.2009|Development, fabrication and characterization of a 3D tactile sensor
    Shams et al.2012|Compact and lightweight optical torque sensor for robots with increased range
    NL1039519C2|2013-09-03|SENSOR FOR THE TACTICAL MEASUREMENT OF FORCES AND MOMENTS.
    EP2015020A1|2009-01-14|Texture measuring apparatus and method
    Nesterov et al.2004|Modelling and investigation of the silicon twin design 3D micro probe
    Lei et al.2014|A 3D micro tactile sensor for dimensional metrology of micro structure with nanometer precision
    Nesterov et al.2006|Modelling and investigation of the mechanical and electrical characteristics of the silicon 3D-boss microprobe for force and deflection measurements
    US7594339B2|2009-09-29|Sensor module for a probe of a tactile coordinate measuring machine
    Kohli et al.2013|MEMS based pressure sensor simulation for healthcare and biomedical applications
    Xue et al.2008|Development of a novel two axis piezoresistive micro accelerometer based on silicon
    Bos et al.2007|Compensation of the anisotropic behavior of single crystalline silicon in a 3D tactile sensor
    CN106482877B|2021-03-16|Five-dimensional force sensor structure based on double-layer planar spring
    Zou et al.2012|Structural and Instrumentation Design of a MEMS Biaxial Accelerometer
    Chen et al.2008|A new type of MEMS two axis accelerometer based on silicon
    JP5578941B2|2014-08-27|3-axis force sensor panel
    Grech et al.2018|A Quasi-Concertina force-displacement MEMS probe for measuring biomechanical properties
    Cullinan et al.2009|Design of micro-scale multi-axis force sensors for precision applications
    同族专利:
    公开号 | 公开日
    DE102009020533B3|2010-09-30|
    DE102009020533C5|2015-12-17|
    NL1037855C2|2010-12-08|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS60140110A|1983-12-28|1985-07-25|Mitsubishi Electric Corp|Method and apparatus for measuring normal line direction of surface of object|
    JPH0431710A|1990-05-28|1992-02-03|Toshiba Corp|Three-dimensional measuring probe|
    DE4309082A1|1993-03-20|1994-09-22|Pietzsch Automatisierungstech|Measuring device for measuring the shape of cylinders|
    WO2007117138A1|2006-04-12|2007-10-18|Technische Universiteit Eindhoven|Measuring scanning probe for scanning a surface to be measured|
    US3617373A|1968-05-24|1971-11-02|Western Electric Co|Methods of making thin film patterns|
    DD252885B5|1986-09-25|1994-07-07|Zentr Mikroelekt Dresden Gmbh|Measuring sensor with piezoresistive resistors|
    IT1206842B|1987-01-15|1989-05-11|Fidia Spa|PROBE DEVICE PARTICULARLY FOR COPYING MACHINE|
    DE3842032C1|1988-12-14|1990-05-31|Juergen Dr. 8028 Taufkirchen De Zorn|Ball-controlled 3-coordinate probe|
    DE4325743C1|1993-07-31|1994-09-08|Heidenhain Gmbh Dr Johannes|Multi-coordinate probe|
    DE10108774A1|2001-02-23|2002-09-05|Zeiss Carl|Coordinate measuring device for probing a workpiece, probe for a coordinate measuring device and method for operating a coordinate measuring device|
    WO2006010395A2|2004-07-23|2006-02-02|Carl Zeiss Industrielle Messtechnik Gmbh|Sensor module for the scanning head of a tactile co-ordinate measuring device|DE102011106894B3|2011-07-07|2012-07-19|Technische Universität Ilmenau|Apparatus for simultaneous measurement of force and moment components, has deformable element that is provided with rod-shaped movable elements with bending joints and edges in cuboid form|
    DE102012219203B3|2012-10-22|2013-11-14|SIOS Meßtechnik GmbH|Device for force- or displacement measurement, has two meander arrangements connected to each other by coupling piece to form parallel spring arrangement, where each meander arrangement has neutral silicon springs and active silicon springs|
    CN103630285B|2013-12-13|2015-11-11|中国航天空气动力技术研究院|Near space vehicle RCS Jet enterference power and disturbance torque measurement mechanism|
    DE102014219280B3|2014-09-24|2015-11-26|SIOS Meßtechnik GmbH|Device for positioning and measuring of measuring objects|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102009020533.0A|DE102009020533C5|2009-05-08|2009-05-08|Device for force component measurement|
    DE102009020533|2009-05-08|
    [返回顶部]